Immersion Silver
Technical information:
- Immersion Silver
- Typ. Ag-coat 0.2–0.4 µm
- Process temperature ~ 50°C
- Shelf life 12 months
Nickel Gold (ENIG)
Technical Info:
- Electroless Nickel Immersion Gold
- Typ. Au-coat 0.05–0.1 µm
- Typ. Ni-coat 4 – 7 µm
- Process temperature ~ 80°C
- Max. shelf life 12 months
Immersion Tin
Technical information:
- Immersion Tin
- Typ. Sb.coat 0.7–1 µm (max. 1.2 µm)
- Process temperature ~ 70°C
- Shelf life 6months
Advantages:
- Smooth coating
- Excellent wetting behaviour
- No additional costs compared with SnPb-HASL
- Good solderability /hole filling
- Application of solder agents with or without lead possible
- Easy multiple soldering
Advantages:
- Universally suitable surface finish
- No Copper attack during soldering process, Nickel serves as diffusion barrier
- Smooth surface
- Soldering (with or without lead, mulitple soldering)
- Storing between solder processes is possible
Advantages:
- Smooth coating
- Good solderability / hole filling
- Suitable for press-fit applications because no burr appears
Disadvantages:
- Restricted storage between multiple solder processes
- Surface might tarnish
Disadvantages:
- Relatively expensive
- Certain limits for press-fit application
Disadvantages:
- Sensitive on scratches
- Sensitive on thermal influence and improper storage conditions
- Only limited shelf life in semi-assembled condition